What you’ll be doing:

• As part of Lab rework team, you will be performing -

• BGA Attach which includes BGA pad leveling, stencil alignments, paste printing, reflow, inspection and x-ray

• BGA Attach profile generation, tuning of chip attach temperature profile, reflow and Re-balling of interposer and multi die packages

• Analyzing and determining the soldering compounds and chemicals needed for variety of soldering and chip reflow process

• Understanding and determining solutions for package and board warpages, solder shorts and related problems that occur on high density boards and large packages.

• board rework, blue wire modification,

• Soldering test points on boards, mounting / soldering probe tips as required from the engineering team.

• Mechanical and thermal Assembly which includes assembling heatsinks, test systems, boards on test platforms

What we need to see:

• ITI Electronics or similar with minimum 4 years of experience in semiconductor industry

• Experience in working on rework stations for BGA attaches.

• Multi-layer PCB assembly and handling skills

• Hand soldering Experience: - Discrete Components of different size, Package 1206, 0805, 0603,0402 and 0201

• Fine pitch soldering and rework [0.5mm & QFN], QFP, SOIC

• Fine pitch IC’s wiring

• Inspection of boards for improper soldering, damages 

• Preparation of different types of cables, Cable crimping, soldering

• Knowledge about mechanical assembly and conformal coating

• Using of different rework equipment, tools – hot air gun, crimping tool, soldering iron

• Knowledge about reading schematics and allegro.

• Basic knowledge about different parts of a Personal computer, computer assembly.